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Michał's avatar

Does anyone have details about how these new dies with a layer of v-cache embedded below cores are manufactured? Previously it required a separate die with the cache to be bonded to the cores die. Is it now part of a single chip? Do all zen 5 have this layer or is it a separate design?

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Nick's avatar

> The GMI link from the CCD to the IO die is unchanged but now it has to route from the CCD down to the SRAM die into the C4 bumps.

Is there no additional latency due to this?

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